XZZ Repair Solder Joints (Spot Welding Patches)
Open Up New Ideas for Maintenance

Overview

In the field of repair, various types of solder pads—such as IC pads on mobile phone motherboards, double-layer motherboards with middle layers, CPU, WIFI hard drives, large audio chips, and touch ICs—can be effectively repaired using spot welding after issues like dropping, shaking, or squeezing. This method achieves results comparable to the original solder pads, ensuring greater stability and reliability.

Product Features

• Multi-Specification & Different Shapes: Designed to suit various dropped solder pads on mobile phones.

• Non-Circle Motherboard Drop Point Design: Eliminates the need for tedious traditional circling methods.

• Quick & Easy Application: Simply tear off the protective layer for instant repair.

• Ultra-Thin Patch: Made from industrial-grade printed circuit board copper foil with a thickness of only 30 µm.

• Trace-Free Repair: Replaces traditional flying wire methods, restoring the original solder pad effect without leaving traces.

Usage Instructions

Tool Preparation:

• XZZ Spot Welding Patch

• Welding Oil

• Welding Green Oil

• UV Curing Lamp

• Desoldering Braid

• Tweezers (Recommended: SS-11 Series Ultra-Sharp Tweezers)

Step-by-Step Process:

1. Clean the Area:
   Use tweezers or desoldering braid to remove oxide and dirt around the detached solder pad to ensure a good connection.

2. Apply the Patch:
   Use tweezers to place the solder joint and weld it to the pad with soldering oil.

3. Insulate & Cure:
   Apply green oil and cure it with a UV lamp for insulation, restoring the original solder pad effect and improving maintenance efficiency.

Benefits

• Quick Replenishment: Instant bonding improves work efficiency and saves time and cost.

• Efficient & Stable: Ensures reliable solder connections for long-lasting repairs.

• Seamless Integration: After spot welding, the motherboard can be directly mounted for functional testing or reassembly, enhancing repair efficiency.

Visual Comparison

• Before Supplementing: Damaged or detached solder pad.

• After Supplementing: Restored solder pad with original effect.

Product Specifications

• Brand: XZZ

• Name: Repair Spot Welding Pieces

• Size: 87 mm (manually measured, for reference only)

• Feature: Suitable for different sizes of solder pads on mobile phone motherboards.

Scope of Application

Ideal for repairing dropped or damaged solder pads on mobile phone motherboards, including double-layer and multi-layer board designs.

Note: Product measurements are manually taken and for reference only. Please refer to the actual product for accurate details.